11月秋季论坛|主旨嘉宾揭晓——味之素 · 徳永 弘樹董事长

蜂虎-PCB信息网 2023-09-06 372次浏览 0条评论
2023中日秋季国际PCB技术/信息论坛

2023秋季2.jpg


2023中日秋季

国际PCB技术/信息论坛


2023年11月7日~8日

中国·深圳

论坛详情


时间地点

时间:2023年11月7日至8日

9:30-17:30


地点:深圳机场希尔顿逸林酒店

深圳市宝安区航城大道66号


组织单位

主办单位:

中国电子电路行业协会CPCA

一般社团法人日本电子回路工业会JPCA


承办单位:

CPCA科学技术工作委员会


媒体支持:

《印制电路信息》杂志社

PCB信息网


主旨论坛嘉宾介绍

(一)

徳永 弘樹

Hiroki Tokunaga

董事長Chairman

味之素(上海)化学制品有限公司

Ajinomoto Shanghai Specialty Chemicals Co., Ltd.


演讲主题:

先进封装材料—味之素堆积膜ABF

Ajinomoto Build-up Film(ABF) ® for Advanced Packaging


摘要 Ajinomoto Build-up Film® (ABF) was developed as an insulation film over 25 years ago and has been widely used for multi-layer IC packages due to its excellent insulation reliability, good resin flow, thickness uniformity, and Semi-Additive Process (SAP) compatibility for fine line and space formation. The unprecedented growth in AI and high-performance computing, combined with the emergence of chiplet based system integration architectures is driving large package body sizes and high package interconnect densities. Insulation materials must have a lower Coefficient of Thermal Expansion (CTE) to maintain reliable insulation and reduce stress in large packages, and a thinner insulation layer to support finer pitch copper wiring. An additional complexity is the need for high-speed signal transmission to increase bandwidth in data center, networking switch, 5G/6G data transmission and automotive infotainment applications. At this symposium, I would like to explain why food companies are dealing with electronic materials also introduce the latest materials.


嘉宾介绍:
Hiroki Tokunaga is Chairman of Ajinomoto Shanghai Specialty Chemicals Co., Ltd. from July in 2021. After majoring in organic chemistry at Tokyo University of Agriculture and Technology, joined Ajinomoto Fine-Techno Co., Inc. in Japan, and has worked in the research and development department, technical sales, and the business department. He belongs to the electronic materials division and has been involved in the business from the beginning of the launch of ABF(Ajinomoto Build-up Film®) which is an insulating material for Flip Chip Package. Also he has given numerous lectures both inside and outside the company, and has a strong connection with cutting-edge companies in the industry. At the end Ajinomoto Shanghai Specialty Chemicals Co., Ltd. is a trading company of the Ajinomoto Group in China, and contributes to customers through the functional materials (Mold inks and Adhesives for camera modules and electronic paper) and Personal Care Ingredient handled by the group company.



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